We got the opportunity to present our DYNANIC solution at the joint national booth of the Czech Republic at SEMICON Europa 2024 held together with electronica in Munich. Our stand was quite nice:
And maybe a question comes into your mind: “Why are they presenting at the semiconductor event like this?” The answer is quite straightforward. Not only were there many partners, so it was a chance to meet them in person at one place, but we are also fully aware that not all customers will benefit from using FPGA technology. That is why we are convinced that we also need to prepare for the development of our chips. By ourselves, or with the help of other partners. Especially when we are talking about hyperscalers, which we are targeting 😉 Events like this are the right chance to build new partnerships to be part of the (not only EU) chip ecosystem.
The event was full of interesting discussions, and we were also very pleased with the visit of the director of the Czechinvest agency (under this agency we completed technological incubation) and the visit of the Speaker of the Chamber of Deputies of the Parliament of the Czech Republic:
We are happy that the Czech Republic also supports these activities because we (EU countries) still have a lot to catch up on:
And finally, we were also given some space in the official conference publication:
Our last event this year will be the Future of Computing Conference 2024 held again in Munich. Will we meet there?
