Brno, Czech Republic – March 3, 2026 — DYNANIC has been selected as a Hello Tomorrow Deep Tech Pioneer, ranking among the top deep tech ventures worldwide. Out of more than 4,800 applications from 108 countries, DYNANIC was recognized for its work in deployable FPGA-based SmartNIC infrastructure.
The selection places DYNANIC among 70 ventures invited to exhibit at the Hello Tomorrow Global Summit in Amsterdam (June 11–12, 2026), where more than 3,000 founders, 1,300 investors, and leading corporate innovators gather.
As Jan Korenek, CSO at DYNANIC, explains:
High-speed networking is becoming a foundational layer of digital infrastructure. At 100–400 Gb/s and beyond, security, latency, and throughput can no longer be solved in software alone. Processing must move directly into a programmable data path.Our selection reflects the growing industry recognition of hardware-accelerated, software-defined network infrastructure.
DYNANIC’s approach to high-performance networking
Modern data centers and telecom networks are reaching scaling limits. CPU-based processing cannot sustain 100–400 Gbps traffic, while fixed-function SmartNICs lack adaptability. DYNANIC transforms standard FPGA cards into fully programmable, line-rate SmartNIC infrastructure. Built on deep pipelining and vertical parallel packet processing, DYNANIC sustains full 400 Gbps throughput in production and scales toward terabit-class performance. It combines ASIC-class acceleration with continuous software evolution, enabling inline cybersecurity and protocol updates without hardware redesign. In-place upgrades extend SmartNIC lifespan, reduce CPU load and power consumption, and preserve vendor independence across major FPGA ecosystems.
Let’s meet in Amsterdam!
DYNANIC has advanced to the second stage of the Hello Tomorrow Challenge, with finalists to be announced in late March 2026.
While preparing for the Summit in Amsterdam, the team remains focused on scaling performance and simplifying deployment of FPGA-based networking infrastructure.
If you will be attending the Summit, we welcome the opportunity to connect.
